CURABLE COMPOSITION INCLUDING EPOXY RESIN AND CURABLE SOLID FILLER
The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
10.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same. |
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Bibliography: | Application Number: EP20180755596 |