POLYIMIDE FILM FOR FLEXIBLE DISPLAY DEVICE SUBSTRATE HAVING EXCELLENT HEAT DISSIPATION CHARACTERISTICS

• Main Authors: KIM, Kyunghwan, PARK, Jinyoung
• Format: Patent
• Language: English; French; German
• Published: 18.11.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The present invention can provide a substrate for a flexible display device, the substrate having a positive CTE value without deterioration in heat resistance even at a temperature of 350 °C or higher, by providing a polyimide obtained from the polymerization of polymerization elements in which p-PDA as a diamine is added in excess of s-BPDA as an acid dianhydride and a terminal sealant containing phthalic anhydride (PA) is added. In addition, such a manufacturing method allows the production of a polyimide film, which has higher transmittance than a polyimide film manufactured with a composition simply having an excess of a diamine, so that TFT devices can be fabricated through alignment keys more easily when the devices are fabricated on polyimide substrates.