POLYIMIDE FILM FOR FLEXIBLE DISPLAY DEVICE SUBSTRATE HAVING EXCELLENT HEAT DISSIPATION CHARACTERISTICS
The present invention can provide a substrate for a flexible display device, the substrate having a positive CTE value without deterioration in heat resistance even at a temperature of 350 °C or higher, by providing a polyimide obtained from the polymerization of polymerization elements in which p-P...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English French German |
Published |
18.11.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present invention can provide a substrate for a flexible display device, the substrate having a positive CTE value without deterioration in heat resistance even at a temperature of 350 °C or higher, by providing a polyimide obtained from the polymerization of polymerization elements in which p-PDA as a diamine is added in excess of s-BPDA as an acid dianhydride and a terminal sealant containing phthalic anhydride (PA) is added. In addition, such a manufacturing method allows the production of a polyimide film, which has higher transmittance than a polyimide film manufactured with a composition simply having an excess of a diamine, so that TFT devices can be fabricated through alignment keys more easily when the devices are fabricated on polyimide substrates. |
---|---|
Bibliography: | Application Number: EP20190803845 |