ONE-PART THERMAL-CURING ACRYLATE ADHESIVE PRECURSOR AND PREPARATION METHOD THEREOF

The present invention provides a one-part thermal-curing acrylate adhesive precursor, calculated by 100 wt. % of said one-part thermal-curing acrylate adhesive precursor, comprising: 20 to 85 wt. % of polyurethane modified acrylate oligomer; 5 to 25 wt. % of methacrylic acid; 5 to 65 wt. % of acryla...

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Bibliographic Details
Main Author TONG, Lingjie
Format Patent
LanguageEnglish
French
German
Published 20.05.2020
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides a one-part thermal-curing acrylate adhesive precursor, calculated by 100 wt. % of said one-part thermal-curing acrylate adhesive precursor, comprising: 20 to 85 wt. % of polyurethane modified acrylate oligomer; 5 to 25 wt. % of methacrylic acid; 5 to 65 wt. % of acrylate monomer; 0.5 to 5 wt. % of adhesion promoter; and 1 to 12 wt. % of initiator. The present invention also provides a preparation method for said one-part thermal-curing acrylate adhesive precursor. According to the technical scheme of the present invention, a one-part acrylate adhesive precursor with excellent adhesive properties, which can be thermal-cured, is provided.
Bibliography:Application Number: EP20180769475