REMANUFACTURING METHOD

A remanufacturing method for remanufacturing a second developing device from a first developing device, the first developing device including a frame provided with a developer accommodating chamber for accommodating a developer, the frame having an opening for communicating the developer accommodati...

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Bibliographic Details
Main Authors NAKAMURA, Shota, ASANUMA, Naoya, KAWAKAMI, Takuya, KUSANO, Yohei, HAMADA, Takatoshi, OOISHI, Koichi
Format Patent
LanguageEnglish
French
German
Published 12.06.2024
Subjects
CINEMATOGRAPHY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
MAGNETOGRAPHY
PHOTOGRAPHY
PHYSICS
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Summary:A remanufacturing method for remanufacturing a second developing device from a first developing device, the first developing device including a frame provided with a developer accommodating chamber for accommodating a developer, the frame having an opening for communicating the developer accommodating chamber with the outside of the frame; and a first cap member configured to seal the opening, the first cap member being adhesively bonded to a first region of the frame with a first adhesive capable of dissolving the frame, and the remanufacturing method including: removing the first cap member from the first region such that a rough surface is formed in the first region; filling the developer accommodating chamber with the developer; and bonding a second cap member different from the first cap member to a second region of the frame different from the first region to seal the opening with the second cap member.
Bibliography:Application Number: EP20190193713