ENCAPSULATED PRINTED CIRCUIT BOARD ASSEMBLY FOR SENSING THE VOLTAGE OF A POWER CABLE IN A POWER DISTRIBUTION NETWORK
Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprisinga) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt,b) an...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
22.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprisinga) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt,b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad,c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB.The high-tension pad extends to the peripheral edge of the PCB. |
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Bibliography: | Application Number: EP20180200932 |