ELECTRIC DEVICE WAFER

A device wafer with functional device structures, comprises a semiconductor substrate (SU) as a carrier wafer, a piezoelectric layer (PL) arranged on the carrier wafer and functional device structures (DS) of a first and a second type realized by a structured metallization on top of the piezoelectri...

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Bibliographic Details
Main Authors MEISTER, Veit, R SLER, Ulrike
Format Patent
LanguageEnglish
French
German
Published 15.04.2020
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:A device wafer with functional device structures, comprises a semiconductor substrate (SU) as a carrier wafer, a piezoelectric layer (PL) arranged on the carrier wafer and functional device structures (DS) of a first and a second type realized by a structured metallization on top of the piezoelectric layer (PL). A space charge region is formed near the top surface of the carrier wafer to yield enhanced electrical isolation between functional device structures (DS) of first and second type.
Bibliography:Application Number: EP20180729941