HEAT SINK ARRANGEMENT

A heat sink arrangement with a composite layer is disclosed. In an embodiment, the arrangement includes a heatsink with a roughened metallic surface, a first dam disposed on an outer perimeter of the heatsink, and a matrix composite layer disposed on the roughened metallic surface and contained by t...

Full description

Saved in:
Bibliographic Details
Main Authors Narayanasamy, Jayaganasan, Lau, Kok Tee, Murugan, Sanjay Kumar, Lee, Hong Lim, Krishnan, Jagen
Format Patent
LanguageEnglish
French
German
Published 29.07.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A heat sink arrangement with a composite layer is disclosed. In an embodiment, the arrangement includes a heatsink with a roughened metallic surface, a first dam disposed on an outer perimeter of the heatsink, and a matrix composite layer disposed on the roughened metallic surface and contained by the first dam, wherein the matrix composite layer comprises a ceramic filler material and a plastic material, and wherein the ceramic filler material includes two or three dimensional particles, platelets, agglomerated particles or a combination thereof.
Bibliography:Application Number: EP20190207243