FLEXIBLE SUBSTRATE MODULE AND FABRICATION METHOD

A digital radiographic image sensor includes a flexible first substrate with an image sensor array. A scintillator is formed over the array, and bonding pads in a peripheral region outside the array are connected to the array. A second substrate is attached to a bottom of the first substrate and inc...

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Bibliographic Details
Main Authors WOJCIK, Timothy, J, MRUTHYUNJAYA, Ravi, K, JADRICH, Bradley, S
Format Patent
LanguageEnglish
French
German
Published 08.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A digital radiographic image sensor includes a flexible first substrate with an image sensor array. A scintillator is formed over the array, and bonding pads in a peripheral region outside the array are connected to the array. A second substrate is attached to a bottom of the first substrate and includes a scribed or perforated break line to enable removal of a peripheral region of the second substrate.
Bibliography:Application Number: EP20170727033