MICRO-ELECTRICAL MECHANICAL SYSTEM SENSOR PACKAGE AND METHOD OF MANUFACTURE THEREOF
A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall;...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
01.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall attaching the first sidewall to the second sidewall; and a first contact pad disposed on an exterior surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor. |
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Bibliography: | Application Number: EP20190196780 |