DRY FILM RESIST STRIPPING SOLUTION COMPOSITION
The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
04.03.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB. |
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Bibliography: | Application Number: EP20190752067 |