ELECTRONIC CIRCUIT BOARD ASSEMBLY

An apparatus (10) includes a substrate (16) and a plurality of conductive traces (20) formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer (26) as a portion of the plurality of conductive traces to inhibit oxidation. A set o...

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Bibliographic Details
Main Authors SHADDOCK, David Mulford, ANDARAWIS, Emad Andarawis
Format Patent
LanguageEnglish
French
German
Published 10.03.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An apparatus (10) includes a substrate (16) and a plurality of conductive traces (20) formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer (26) as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads (18) are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device (14) is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.
Bibliography:Application Number: EP20190200655