THIN-PLATE SUBSTRATE HOLDING FINGER AND TRANSFER ROBOT PROVIDED WITH SAID FINGER

Provided is holding finger 21 with which a thin-plate substrate W that has been subjected to surface processing can be transferred without generating a natural oxide film on a surface to be processed of the thin-plate substrate W. The holding finger 21 comprises: a finger body 47 which is internally...

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Bibliographic Details
Main Author SAKATA Katsunori
Format Patent
LanguageEnglish
French
German
Published 01.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Provided is holding finger 21 with which a thin-plate substrate W that has been subjected to surface processing can be transferred without generating a natural oxide film on a surface to be processed of the thin-plate substrate W. The holding finger 21 comprises: a finger body 47 which is internally formed with a flow path for circulating an inert gas; a pipe member which provides communication between an inert gas supply source and the flow path; an ejection port for ejecting the inert gas onto the surface to be processed of the thin-plate substrate W, the ejection port communicating with the flow path and being disposed on a surface of the finger body 47 opposing the surface to be processed of the thin-plate substrate W; an abutting member 49 which is disposed on the surface of the finger body 47 on which the ejection port is formed, and which abuts a peripheral portion of the thin-plate substrate W; a clamp member 57 which is disposed to be movable forward and backward with respect to the thin-plate substrate W; and a clamp mechanism for the clamp member 57 forward and backward.
Bibliography:Application Number: EP20180797715