THIN, HIGH-STIFFNESS LAMINATES, PORTABLE ELECTRONIC DEVICE HOUSINGS INCLUDING THE SAME, AND METHODS FOR MAKING SUCH LAMINATES AND PORTABLE ELECTRONIC DEVICE HOUSINGS
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wh...
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Format | Patent |
Language | English French German |
Published |
05.02.2020
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Online Access | Get full text |
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Abstract | The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wherein the laminate has a width, a length that is perpendicular to the width, the length being between approximately 1.25 and approximately 1.80 times the width, a thickness that is perpendicular to each of the width and the length, the thickness being between approximately 1.0 mm and approximately 1.5 mm, and a first flexural rigidity along the width and a second flexural rigidity along the length, the second flexural rigidity being 10 to 30 times the first flexural rigidity. |
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AbstractList | The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wherein the laminate has a width, a length that is perpendicular to the width, the length being between approximately 1.25 and approximately 1.80 times the width, a thickness that is perpendicular to each of the width and the length, the thickness being between approximately 1.0 mm and approximately 1.5 mm, and a first flexural rigidity along the width and a second flexural rigidity along the length, the second flexural rigidity being 10 to 30 times the first flexural rigidity. |
Author | VERGHESE, Nikhil KASHIF, Syed Muhammad THEOFANOUS, Theofanis |
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DocumentTitleAlternate | DÜNNE, HOCHSTEIFE LAMINATE, GEHÄUSE FÜR TRAGBARE ELEKTRONISCHE VORRICHTUNG DAMIT UND VERFAHREN ZUR HERSTELLUNG SOLCHER LAMINATE UND GEHÄUSE FÜR TRAGBARE ELEKTRONISCHE VORRICHTUNGEN STRATIFIÉS MINCES À RIGIDITÉ ÉLEVÉE, BOÎTIERS DE DISPOSITIFS ÉLECTRONIQUES PORTABLES LES COMPRENANT, ET PROCÉDÉS DE FABRICATION DE TELS STRATIFIÉS ET BOÎTIERS DE DISPOSITIFS ÉLECTRONIQUES PORTABLES |
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Notes | Application Number: EP20180716347 |
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RelatedCompanies | SABIC Global Technologies B.V |
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Snippet | The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates... |
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Title | THIN, HIGH-STIFFNESS LAMINATES, PORTABLE ELECTRONIC DEVICE HOUSINGS INCLUDING THE SAME, AND METHODS FOR MAKING SUCH LAMINATES AND PORTABLE ELECTRONIC DEVICE HOUSINGS |
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