THIN, HIGH-STIFFNESS LAMINATES, PORTABLE ELECTRONIC DEVICE HOUSINGS INCLUDING THE SAME, AND METHODS FOR MAKING SUCH LAMINATES AND PORTABLE ELECTRONIC DEVICE HOUSINGS
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wh...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English French German |
Published |
05.02.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include two or more laminae, each having fibers dispersed within a matrix material, wherein the laminate has a width, a length that is perpendicular to the width, the length being between approximately 1.25 and approximately 1.80 times the width, a thickness that is perpendicular to each of the width and the length, the thickness being between approximately 1.0 mm and approximately 1.5 mm, and a first flexural rigidity along the width and a second flexural rigidity along the length, the second flexural rigidity being 10 to 30 times the first flexural rigidity. |
---|---|
Bibliography: | Application Number: EP20180716347 |