HEAT TRANSFER STRUCTURE, POWER ELECTRONICS MODULE, COOLING ELEMENT, METHOD OF MANUFACTURING A HEAT TRANSFER STRUCTURE AND METHOD OF MANUFACTURING A POWER ELECTRONICS COMPONENT

A heat transfer structure, wherein the structure comprises a metallic body having a first surface and a second surface. The first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and the metallic...

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Bibliographic Details
Main Authors Manninen, Jorma, Ingman, Kjell, Silvennoinen, Mika
Format Patent
LanguageEnglish
French
German
Published 09.02.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A heat transfer structure, wherein the structure comprises a metallic body having a first surface and a second surface. The first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and the metallic body comprises a carbon based insert.
Bibliography:Application Number: EP20190181416