BUFFERED ADHESIVE STRUCTURES FOR WEARABLE PATCHES

The present invention describes multilayered adhesive structures that can be used as adhesives to mount wearable devices onto the skin. The multilayered adhesive structures can comprise a buffer layer sandwiched between two adhesive layers, a first adhesive layer adhering the multilayered adhesive s...

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Bibliographic Details
Main Author HUPPERT, Gilbert Lee
Format Patent
LanguageEnglish
French
German
Published 30.10.2019
Subjects
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Summary:The present invention describes multilayered adhesive structures that can be used as adhesives to mount wearable devices onto the skin. The multilayered adhesive structures can comprise a buffer layer sandwiched between two adhesive layers, a first adhesive layer adhering the multilayered adhesive structure to the wearable device and a second adhesive layer adhering the buffer layer to the skin. The buffer layer separates or isolates the wearable device from the skin. By mechanically buffering the wearable device from the skin, the multilayered adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.
Bibliography:Application Number: EP20170884178