TESTING HEAD HAVING IMPROVED FREQUENCY PROPERTIES
A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house t...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
23.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal. |
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Bibliography: | Application Number: EP20170825770 |