CHIP-SCALE LINEAR LIGHT-EMITTING DEVICE

• Main Authors: CHANG, Chia-Hsien, CHEN, Chieh
• Format: Patent
• Language: English; French; German
• Published: 25.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A chip-scale linear light-emitting device (10A; 10B; 10C; 10D; 10E; 10F; 10G) includes a submount substrate (11), light-emitting diode (LED) semiconductor chips (12), a chip-scale packaging structure (13; 13') and a reflective structure (14; 14'). The LED semiconductor chips (12), the packaging structure (13; 13') and the reflective structure (14; 14') are disposed on the submount substrate (11), wherein the packaging structure (13; 13') covers a chip-upper surface (121) and/or at least one of chip-edge surfaces (1231, 1232, 1233, 1234) of the LED semiconductor chips (12), and the reflective structure (14; 14') covers at least a package-top surface (131) or at least package-side surfaces (132') of the packaging structure (13; 13'). If one of the chip-edge surfaces (1231, 1232, 1233, 1234) and a package-side surface of the packaging structure (13) are exposed from the reflective structure (14) as a light-emitting side surface (132), a side-view type linear light-emitting device is formed. If the chip-upper surface (121) and the package-top surface of the packaging structure (13') are exposed from the reflective structure (14') as a light-emitting top surface (131'), a top-view type linear light-emitting device is formed. A substantially transparent light-transmitting material and/or a photoluminescent material can be configured to be included inside the packaging structure (13; 13'). In this configuration, a primary light emitted from the LED semiconductor chips (12) is directed to pass through the packaging structure (13; 13') and radiated outward from a primary light-emitting surface. Therefore, a monochromatic light or a white light with a uniformly distributed linear radiation pattern can be generated using the chip-scale linear light-emitting device (10A; 10B; 10C; 10D; 10E; 10F; 10G).