USE OF AN ETCHING SOLUTION FOR TUNGSTEN WORD LINE RECESS

Described herein is an etching solution suitable for both tungsten-containing metals and TiN-containing materials, which comprises: water; and one or more than one oxidizers; and one or more than one of the components selected from the group consisting of: one or more fluorine-containing-etching com...

Full description

Saved in:
Bibliographic Details
Main Authors LEE, Yi-Chia, LIU, Wen Dar, GE, Jhih Kuei
Format Patent
LanguageEnglish
French
German
Published 22.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Described herein is an etching solution suitable for both tungsten-containing metals and TiN-containing materials, which comprises: water; and one or more than one oxidizers; and one or more than one of the components selected from the group consisting of: one or more fluorine-containing-etching compounds, one or more organic solvents, one or more chelating agents, one or more corrosion inhibitors and one or more surfactants.
Bibliography:Application Number: EP20190163162