METHOD FOR JOINING SUBSTRATES AND PLASTICS USING AN AREA OF CONTROLLED HEAT ADHESION

• Main Authors: PERDIGONES SÁNCHEZ, Francisco Antonio, CABELLO VALVERDE, Miguel, QUERO REBOUL, José Manuel, DOMÍNGUEZ BLAS, Salvador, FRANCO GONZÁLEZ, Emilio
• Format: Patent
• Language: English; French; German
• Published: 07.08.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The subject matter of the invention is a method for the adhesion of substrates to plastics that may or may not be machined. This is a manufacturing process for a plastic (1), that may be machined or not, to a substrate (2) with a metal on its surface. The process is based on the generation of heat, caused by the Joule effect, when an electric current passes through an element that conducts electricity (3). A relevant aspect of the invention is the inclusion of a mechanical-thermal barrier (8), the main function of which is to lower the temperature so that the plastic material solidifies exactly in the area where said barrier is present. The invention lies in the area of manufacturing and materials technology, and can be applied in a very broad range of activities: the main uses for this adhesion and shaping of structures lies in the manufacture of lab-on-chip circuits for biological or environmental applications. It can also be used to make protective plastic casings over electronic circuits assembled on printed circuits.