METHOD FOR EXPOSING A REGION ON A SURFACE OF AN ELECTRONIC DEVICE

A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover (600) to the front face, the bonding being undertaken such that the cover (600) forms a closed cavity (650) with the region, a...

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Bibliographic Details
Main Authors CASTANY, Olivier, CHARBONNIER, Jean, PORNIN, Jean-Louis
Format Patent
LanguageEnglish
French
German
Published 14.10.2020
Subjects
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover (600) to the front face, the bonding being undertaken such that the cover (600) forms a closed cavity (650) with the region, advantageously hermetically sealed; Formation of an encapsulation coating (700), of thickness E1, covering the front face and the cover (600); A thinning step for the encapsulation coating (700), the thinning step including removal of a removal thickness E2, less than the thickness E1, of the encapsulation coating (700), the removal thickness E2 being adjusted such that an opening is formed in the cover (600).
Bibliography:Application Number: EP20180214893