THERMOPILE MESH

A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of...

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Bibliographic Details
Main Authors MAHMOUDI, Farsheed, FLEMING, Evan Bentley, MERRIKH, Ali Akbar, SAEIDI, Mehdi
Format Patent
LanguageEnglish
French
German
Published 14.10.2020
Subjects
ELECTRICITY
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.
Bibliography:Application Number: EP20170757983