METHOD AND APPARATUS FOR BENDING DECOUPLED ELECTRONICS PACKAGING

An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enc...

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Bibliographic Details
Main Authors HAUBOLD, Carsten, MUELLER, Tim, TREVIRANUS, Joachim, PETER, Andreas
Format Patent
LanguageEnglish
French
German
Published 29.09.2021
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Summary:An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enclosure that does not mechanically overload the electronics module. In some embodiments, the joint may be a ball joint.
Bibliography:Application Number: EP20170837754