METHOD AND APPARATUS FOR BENDING DECOUPLED ELECTRONICS PACKAGING
An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enc...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
29.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | An apparatus for protecting an electronics module used in a borehole may include an enclosure disposed along a drill string. The electronics module may be attached to the enclosure by at least one joint. The at least one joint allows a predetermined bending between the electronics module and the enclosure that does not mechanically overload the electronics module. In some embodiments, the joint may be a ball joint. |
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Bibliography: | Application Number: EP20170837754 |