EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL

• Main Authors: SANO, Kentaro, TAKAIWA, Reo, KURODA, Taiki, HIRANO, Noriyuki
• Format: Patent
• Language: English; French; German
• Published: 05.08.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. It provides an epoxy resin composition that includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets the undermentioned conditions (a) to (d): (a) it contains an isocyanurate type epoxy resin [A1] as component [A] in an amount of 10 to 40 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (b) it contains a bisphenol type epoxy resin [A2] as a component [A] in an amount of 40 to 90 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (c) resin [A2] has an average epoxy equivalent weight of 220 to 500 g/eq, and (d) the content of component [B] is such that the ratio of the number of imidazole groups to the total number of epoxy groups in the epoxy resins is 0.01 to 0.06.