METHOD FOR REMOVING FILLING MATERIAL FROM A CAVITY PRESENT IN A COMPONENT AND APPARATUS FOR PERFORMING SAID METHOD

Various embodiments may include a method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising: holding the component in a movable mounting; moving the component and at the same time r...

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Bibliographic Details
Main Author KIENER, Christoph
Format Patent
LanguageEnglish
French
German
Published 01.05.2019
Subjects
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Summary:Various embodiments may include a method for removing filling material from a cavity in a manufactured component with a connection from the cavity opening to surroundings of the component, the method comprising: holding the component in a movable mounting; moving the component and at the same time removing the filling material through the connection opening; and executing a computer program with a processor, wherein the computer program instructs the processor to: analyze geometry data of the component including the connection opening; and calculate a necessary positioning of the component, based on the geometry data and gravitational force; and direct the movable mounting through a sequence of movements for moving the component in space to spill the filling material from the cavity through the connection opening out of the component.
Bibliography:Application Number: EP20170768691