AN ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT

• Main Authors: Bewick, Nicholas, Dr, Adolf, James, Dr, Wu, Jun, Dr, Ackermann, Stefanie, Dr, Bolton, Onas, Dr, Si, Kun, Dr
• Format: Patent
• Language: English; French; German
• Published: 30.12.2020
• Subjects: APPARATUS THEREFOR; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to an acidic aqueous composition for electrolytically depositing a copper deposit, the composition comprising (i) copper (II) ions, (ii) one or more than one compound of formula (la) (iii) one, two, three or more than three further compounds, which are different from the compound of formula (la), with the definitions given throughout the text, the use of the acidic aqueous composition for electrolytically depositing a copper deposit, the use of the compound of formula (la) as surfactant in preferably an acidic aqueous composition, a method for electrolytically depositing a copper deposit onto a substrate, and a compound of formula (la), preferably a specific compound derived from formula (la).