LOW-VISCOSITY EPOXY RESINS AND LOW VOC CURABLE FORMULATIONS THEREFROM

The present invention provides curable moldable compositions comprising from 10 to 80 volume % of heat resistant fiber compositions, a two component resin mixture of (i) one or more epoxy resins, and (ii) a hardener comprising a combination of triethylenetetraamine (TETA) and from 3 to 15 wt. %, bas...

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Bibliographic Details
Main Authors LOTTI, Luca, JELIC, Nebojsa, TSOUTSOURA, Aikaterini, MORLEY, Timothy A, KOENIGER, Rainer, SIKMAN, Zeljko
Format Patent
LanguageEnglish
French
German
Published 10.04.2019
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The present invention provides curable moldable compositions comprising from 10 to 80 volume % of heat resistant fiber compositions, a two component resin mixture of (i) one or more epoxy resins, and (ii) a hardener comprising a combination of triethylenetetraamine (TETA) and from 3 to 15 wt. %, based on the weight of the TETA, of 2-phenylimidazole (2-PI). The compositions cure to provide composite articles having a short demold time of 90 s or less at 130° C. and 101 kPa and a high DSC glass transition temperature (Tg) of from 130 to 180° C. when cured at 130° C. for 90 seconds at a pressure of 101 kPa. The invention enables lightweight, heat resistant composite articles, such as for use in automotive applications.
Bibliography:Application Number: EP20170725482