ADHESIVE FORMULATIONS WITH IMPROVED THERMAL AND BONDING PROPERTIES

• Main Authors: ARANDILLA COLIAS, Borja, SEGURA FERNÁNDEZ, Sonia, RUIZ ORTA, Carolina, YÁÑEZ PACIOS, Andrés Jesús, MARÍN PERALES, Laura, GARCÍA RUIZ, Mónica, MARTÍN MARTÍNEZ, José Miguel
• Format: Patent
• Language: English; French; German
• Published: 19.02.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30° C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylen...