ADHESIVE FORMULATIONS WITH IMPROVED THERMAL AND BONDING PROPERTIES

The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30° C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylen...

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Main Authors ARANDILLA COLIAS, Borja, SEGURA FERNÁNDEZ, Sonia, RUIZ ORTA, Carolina, YÁÑEZ PACIOS, Andrés Jesús, MARÍN PERALES, Laura, GARCÍA RUIZ, Mónica, MARTÍN MARTÍNEZ, José Miguel
Format Patent
LanguageEnglish
French
German
Published 19.02.2020
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention refers to a composition comprising: (a) 5-95 wt % of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30° C. and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt % of poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature higher than 30° C. It also refers to a method for producing said composition as well as to its use for preparing adhesive formulations with improved thermal stability and adhesion properties.
Bibliography:Application Number: EP20170722422