METHOD FOR MANUFACTURING POLISHING PAD

A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25°C) to 40,000 cps (at 25°C) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60°C to...

Full description

Saved in:
Bibliographic Details
Main Authors JUNG, Dae-Han, LEE, Ha-Woo, AN, Bong-Soo, CHOO, Jeong-Seon, KIM, Seung-Geun, HONG, Gi-Sik, PARK, Gi-Young, KANG, Hak-Su
Format Patent
LanguageEnglish
French
German
Published 09.10.2019
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25°C) to 40,000 cps (at 25°C) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60°C to 150°C, and manufacturing a polishing layer including porous pores by causing a mixture produced at the mixing to be subjected to gelation and curing in a predetermined cast.
Bibliography:Application Number: EP20160858489