METHODS FOR METALIZING VIAS WITHIN A SUBSTRATE

Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate...

Full description

Saved in:
Bibliographic Details
Main Authors JAYARAMAN, Shrisudersan, DAHLBERG, Rachel Eileen
Format Patent
LanguageEnglish
French
German
Published 06.02.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate directly contacts a surface of the growth substrate, and the surface of the growth substrate is electrically conductive. The method further includes applying an electrolyte to the substrate such that the electrolyte is disposed within the at least one via. The electrolyte includes metal ions of a metal to be deposited within the at least one via. The method also includes positioning an electrode within the electrolyte, and applying a current and/or a voltage between the electrode and the substrate, thereby reducing the metal ions into the metal on the surface of the growth substrate within the at least one via.
Bibliography:Application Number: EP20170717287