HEAT TRANSFER ASSEMBLY FOR A HEAT EMITTING DEVICE

A heat transfer assembly (100) useful for dissipating heat from a heat emitting device (310) is disclosed. The assembly includes a module inlet (170,540,550,560) for receiving a coolant, at least one module (110) having a first part (120) with a recess (130) to receive a portion of the heat emitting...

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Bibliographic Details
Main Authors WADDELL, Alistair Martin, SCHROEDER, Stefan, CHAN, Mark Aaron Chan
Format Patent
LanguageEnglish
French
German
Published 23.01.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A heat transfer assembly (100) useful for dissipating heat from a heat emitting device (310) is disclosed. The assembly includes a module inlet (170,540,550,560) for receiving a coolant, at least one module (110) having a first part (120) with a recess (130) to receive a portion of the heat emitting device (310,390), and a second part (140) having a shaped cutout portion (150) and a solid portion (160), where the second part (140) allows a uniform compression of a seal component (132) disposed on the first part (120). The first part (120) and the second part (140) are mechanically connected to each other; and a module outlet (180) is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device (310,390), where the at least one module (110) is connected to the module inlet (170,540,550,560) and the module outlet (180).
Bibliography:Application Number: EP20180176970