OUT OF PLANE STRUCTURES AND METHODS FOR MAKING OUT OF PLANE STRUCTURES

A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive la...

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Bibliographic Details
Main Authors WANG, Qian, CHUA, Christopher L, WANG, Yu
Format Patent
LanguageEnglish
French
German
Published 06.09.2023
Subjects
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