OUT OF PLANE STRUCTURES AND METHODS FOR MAKING OUT OF PLANE STRUCTURES

A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive la...

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Bibliographic Details
Main Authors WANG, Qian, CHUA, Christopher L, WANG, Yu
Format Patent
LanguageEnglish
French
German
Published 06.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive layer is disposed over the elastic portions and the anchor portions. The device includes one or more electrically conductive stubs that extend between two adjacent anchor portions without electrically connecting the two adjacent anchor portions.
Bibliography:Application Number: EP20180181301