OUT OF PLANE STRUCTURES AND METHODS FOR MAKING OUT OF PLANE STRUCTURES
A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive la...
Saved in:
| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | English French German |
| Published |
06.09.2023
|
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive layer is disposed over the elastic portions and the anchor portions. The device includes one or more electrically conductive stubs that extend between two adjacent anchor portions without electrically connecting the two adjacent anchor portions. |
|---|---|
| AbstractList | A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive layer is disposed over the elastic portions and the anchor portions. The device includes one or more electrically conductive stubs that extend between two adjacent anchor portions without electrically connecting the two adjacent anchor portions. |
| Author | WANG, Yu CHUA, Christopher L WANG, Qian |
| Author_xml | – fullname: WANG, Qian – fullname: CHUA, Christopher L – fullname: WANG, Yu |
| BookMark | eNrjYmDJy89L5WRw8w8NUfB3UwjwcfRzVQgOCQp1DgkNcg1WcPRzUfB1DfHwdwlWcPMPUvB19Pb0c1fAoZyHgTUtMac4lRdKczMouLmGOHvophbkx6cWFyQmp-allsS7BhibGBsZG5k4GRoToQQAcZMtpg |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | STRUCTURES HORS PLAN ET PROCÉDÉS DE FABRICATION DE STRUCTURES HORS PLAN AUSSERHALB-DER-EBENE-STRUKTUREN UND VERFAHREN ZUR HERSTELLUNG VON AUSSERHALB-DER-EBENE-STRUKTUREN |
| ExternalDocumentID | EP3432324B1 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_EP3432324B13 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 13:57:29 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English French German |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_EP3432324B13 |
| Notes | Application Number: EP20180181301 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230906&DB=EPODOC&CC=EP&NR=3432324B1 |
| ParticipantIDs | epo_espacenet_EP3432324B1 |
| PublicationCentury | 2000 |
| PublicationDate | 20230906 |
| PublicationDateYYYYMMDD | 2023-09-06 |
| PublicationDate_xml | – month: 09 year: 2023 text: 20230906 day: 06 |
| PublicationDecade | 2020 |
| PublicationYear | 2023 |
| RelatedCompanies | Palo Alto Research Center Incorporated |
| RelatedCompanies_xml | – name: Palo Alto Research Center Incorporated |
| Score | 3.484494 |
| Snippet | A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS |
| Title | OUT OF PLANE STRUCTURES AND METHODS FOR MAKING OUT OF PLANE STRUCTURES |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230906&DB=EPODOC&locale=&CC=EP&NR=3432324B1 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NS8MwFH-MKepNp-L8Igfprdh2XbceivTTIvaDtZXdRtOlsEs3XMV_35fQTS_zFpLwSF54ee-XvA-AJ44q8GwrWR_XtazXVJcpWv1yZVaKRkdMKUU5nyg2wkJ_m4_nPVjtYmFEntBvkRwRJapCeW_Ffb35fcTyhG_l9pmusGv9EuSWJ3XoGO1pUzEkz7H8NPESV3JdbEnxzOLxk2g7OAiUjrgVzdPs-x8OD0rZ_NUowTkcp0isaS-gx5oBnLq7wmsDOIm6_25sdqK3vYQgKXKSBCR9t2OfZPmscLnHQkbs2CORn4eJlxGEdCSyEZG_kgPTr4AEfu6GMi5osd_8wk_3Sx9dQ79ZN-wGCJugFilLQ1XrWlcrjVKmTRGrLacmM7SlOYThQTK3_4zdwRnnonCiMu6h335-sQfUui19FPz6ATPqf_0 |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NT8IwFH8haMSbokbwqwez2yKMMdhhMWMfTt1X2DDclnV0CZdBZMZ_39cG0AvemrZ5aV_z-t6vfR8AjxxV4NkWsjosS1ktqSpTtPrlQi96Ch2wXi7K-QSh5s3Ut_lw3oDlLhZG5An9FskRUaIKlPda3Nfr30csW_hWbp7oErtWz25q2NIWHaM9rfc0yZ4YThzZkSVZFrakcGrw-Em0HSYIlI5GPDkvt5w-JjwoZf1Xo7hncBwjsao-hwar2tCydoXX2nASbP-7sbkVvc0FuNEsJZFLYt8MHZKk05nFPRYSYoY2CZzUi-yEIKQjgYmI_IUcmH4JxHVSy5NxQdl-85kT75c-uIJmtarYNRA2Qi2S51q_X5Zqv1AoZcoYsdpirDNNWegd6Bwk0_1n7AFaXhr4mf8avt_AKeeocKjSbqFZf36xO9TANb0XvPsBWH2C6g |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=OUT+OF+PLANE+STRUCTURES+AND+METHODS+FOR+MAKING+OUT+OF+PLANE+STRUCTURES&rft.inventor=WANG%2C+Qian&rft.inventor=CHUA%2C+Christopher+L&rft.inventor=WANG%2C+Yu&rft.date=2023-09-06&rft.externalDBID=B1&rft.externalDocID=EP3432324B1 |