STAIRSTEP INTERPOSERS WITH INTEGRATED SHIELDING FOR ELECTRONICS PACKAGES

Disclosed herein are stairstep interposers with integrated conductive shields, and related assemblies and techniques. In some embodiments, an interposer may include: an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface to face a p...

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Bibliographic Details
Main Authors CHEAH, Bok Eng, LO, Hungying Louis
Format Patent
LanguageEnglish
French
German
Published 10.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed herein are stairstep interposers with integrated conductive shields, and related assemblies and techniques. In some embodiments, an interposer may include: an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface to face a package substrate, wherein a first thickness of the insulating material between the first step surface and the bottom surface is greater than a second thickness of the insulating material between the second step surface and the bottom surface; a conductive signal pathway extending from the first step surface to the bottom surface; and a conductive shield disposed within the insulating material to shield the conductive signal pathway.
Bibliography:Application Number: EP20160894743