METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC ACTIVITY INHIBITOR AND COMPOSITE MATERIAL FOR ELECTROLESS PLATING

• Main Authors: YUSA, Atsushi, USUKI, Naoki, KITO, Akiko
• Format: Patent
• Language: English; French; German
• Published: 16.01.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided is a method for producing a plated component, which is capable of forming a plating film only on a predetermined pattern by suppressing the formation of a plating film on regions other than the predetermined pattern by a simple production process. A method for producing a plated component, which comprises: formation of a catalytic activity inhibitory layer, which contains a polymer having at least one of an amide group and an amino group, on the surface of a base; heating of or light irradiation on a part of the base surface on which the catalytic activity inhibitory layer has been formed; application of an electroless plating catalyst to the base surface which has been subjected to heating or light irradiation; and formation of an electroless plating film on the heated portion or the light irradiated portion of the surface by bringing an electroless plating solution into contact with the base surface to which the electroless plating catalyst has been applied.