METHOD FOR PRODUCING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE

A method for producing a device (1) comprising or constituting an electronic module (1A, 1B, 1C), said module comprising an integrated circuit chip (12) having electrical contact pads (12a, 12b), an insulating material (2) covering at least each pad (12a, 12b), and a projecting interconnection porti...

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Bibliographic Details
Main Authors CHARLES, Luc, LAVIRON, Thierry, OTTOBON, Stéphane, DOSSETTO, Lucile
Format Patent
LanguageEnglish
French
German
Published 16.01.2019
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:A method for producing a device (1) comprising or constituting an electronic module (1A, 1B, 1C), said module comprising an integrated circuit chip (12) having electrical contact pads (12a, 12b), an insulating material (2) covering at least each pad (12a, 12b), and a projecting interconnection portion (31a, 32a) of an electrical element, connected to each contact pad and extending outwards. The method is characterised in that each projecting interconnection portion (31a, 32a) is configured to have an interconnection width greater than 100 μm or greater than or equal to the width of each electrical contact pad (12a, 12b). The invention also relates to a module obtained thereby and to a device comprising same.
Bibliography:Application Number: EP20170708284