HEAT MODULATING FOOD PACKAGING MATERIAL
An oven may include a cooking chamber configured to receive a heat modulating material (HMM), a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber, and a cooking controller configured to control the frequency of RF energy provided by the RF heating system in...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
17.05.2023
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Subjects | |
Online Access | Get full text |
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Summary: | An oven may include a cooking chamber configured to receive a heat modulating material (HMM), a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber, and a cooking controller configured to control the frequency of RF energy provided by the RF heating system into the cooking chamber. The MINI may be configured to contain a food product and may include a thermally active section. The thermally active section may include a base matrix and a particulate material dispersed in the base matrix. |
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Bibliography: | Application Number: EP20170711427 |