APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SEMICONDUCTOR DIE

Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plur...

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Bibliographic Details
Main Author HEMBREE, David R
Format Patent
LanguageEnglish
French
German
Published 26.12.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.
Bibliography:Application Number: EP20170753656