METHOD FOR FORMING A COMPOSITE LAYER AND WORKPIECE WITH A COMPOSITE LAYER

A method for forming a composite layer on a workpiece and a workpiece with a composite layer are disclosed. In an embodiment, the composite layer is formed by depositing a first material on a semiconductor device or a workpiece, and then depositing a second material on the first material. In another...

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Bibliographic Details
Main Authors Narayanasamy, Jayaganasan, Lau, Kok Tee, Murugan, Sanjay Kumar, Lee, Hong Lim, Krishnan, Jagen
Format Patent
LanguageEnglish
French
German
Published 17.10.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for forming a composite layer on a workpiece and a workpiece with a composite layer are disclosed. In an embodiment, the composite layer is formed by depositing a first material on a semiconductor device or a workpiece, and then depositing a second material on the first material. In another embodiment the workpiece is a semiconductor device. In another embodiment method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. In a further embodiment a vacuum treatment is performed on the first and second materials thereby forming a matrix composite layer disposed on the metallic surface.
Bibliography:Application Number: EP20180166919