METHOD OF MAKING A MULTILAYER STRUCTURE

• Main Authors: HIPP, Alexander, WEVERS, Ronald, SALMINEN, Pekka, ZUERCHER, Karl, FEHR, Bernard, VYORYKKA, Jouko
• Format: Patent
• Language: English; French; German
• Published: 20.12.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; IMPREGNATING OR COATING OF PAPER; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PERFORMING OPERATIONS; POLISHES; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; TEXTILES; TRANSPORTING; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; USE OF MATERIALS AS ADHESIVES

The present invention relates to a process for making a multilayer structure comprising the steps of: providing a first layer comprising one or more primary layers having a thickness in the range of less than 1 mm; providing one or more polyolefin dispersions comprising; at least one or more base polymers; at least one or more stabilizing agents; from 25 to 65 percent by weight of calcium carbonate; a liquid media and; optionally one or more neutralizing agents; applying said one or more polyolefin dispersions to one or more surfaces of said one or more primary layers; removing at least a portion of the liquid media from said one or more polyolefin dispersions; thereby forming a second layer comprising one or more secondary layers having a thickness in the range of less than 15 µm, wherein said second layer is associated with at least one surface of said first layer; thereby forming an intermediate structure; forming a third layer comprising one or more tertiary layers having a thickness in the range of less than 150 µm; bonding said third layer to one or more surfaces of said intermediate structure; thereby forming said multilayer structure, wherein said second layer is disposed therebetween said first layer and said third layer.