HEAT-DISSIPATING SUBSTRATE AND ELECTRICALLY DRIVEN POWER STEERING DEVICE

Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a r...

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Bibliographic Details
Main Author SHIMAKAWA, Shigeru
Format Patent
LanguageEnglish
French
German
Published 04.09.2019
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MOTOR VEHICLES
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRAILERS
TRANSPORTING
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Summary:Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of a bottom surface portion of the electronic component is projected to a mounting surface in a direction perpendicular to the mounting surface, and a surface density of the thermal vias which occupy the mounting surface per unit area is at least partially different. The plurality of thermal vias are disposed so that the surface density of the thermal vias becomes the greatest in a dense region on an inner side of an edge portion of the electronic component projection region.
Bibliography:Application Number: EP20160870526