METHOD FOR ULTRASONIC WIRE BONDING WITH ACTIVE AND PASSIVE VIBRATION DAMPING

A method for operating an ultrasonic wire bonder. The ultrasonic wire bonder has a bonding head with a bonding tool and with a transducer for exciting ultrasonic vibrations in the bonding tool and a controller (2) for the transducer (1). In a first process phase I a bonding wire is bonded to a subst...

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Bibliographic Details
Main Authors HUNSTIG, Matthias, BRÖKELMANN, Michael
Format Patent
LanguageEnglish
French
German
Published 04.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CURRENT COLLECTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method for operating an ultrasonic wire bonder. The ultrasonic wire bonder has a bonding head with a bonding tool and with a transducer for exciting ultrasonic vibrations in the bonding tool and a controller (2) for the transducer (1). In a first process phase I a bonding wire is bonded to a substrate. The bonding wire is pressed against the substrate with a bonding force via a tool tip of the bonding tool, and the bonding tool is then excited so as to undergo ultrasonic vibrations in order to produce a bond between the bonding wire and the substrate, the transducer (1) being excited so as to vibrate for a specified or variable bonding time. In a second process phase II, the actuation of the transducer (1) is changed and reverberations of the bonding tool are counteracted, the transducer (1) being operated in a damped manner.
Bibliography:Application Number: EP20160828922