MICRODISPLAY MODULE HAVING A REDUCED SIZE
Disclosed is a low-profile microdisplay module that comprises a package substrate, a microdisplay chip disposed over a first surface of the package substrate, and a plurality of conductive vias. The plurality of conductive vias are electrically coupled to the microdisplay chip and disposed through t...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
12.09.2018
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a low-profile microdisplay module that comprises a package substrate, a microdisplay chip disposed over a first surface of the package substrate, and a plurality of conductive vias. The plurality of conductive vias are electrically coupled to the microdisplay chip and disposed through the package substrate to a second surface of the package substrate, the second surface being opposite and parallel to the first surface. The microdisplay module further comprises a flexible flat circuit connector coupled to the plurality of conductive vias at the second surface of the package substrate. |
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Bibliography: | Application Number: EP20160795513 |