LOCAL SEMICONDUCTOR WAFER THINNING

A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.

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Bibliographic Details
Main Authors RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Format Patent
LanguageEnglish
French
German
Published 22.08.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.
Bibliography:Application Number: EP20160855948