METAL PASTE AND THERMOELECTRIC MODULE

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which ad...

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Bibliographic Details
Main Authors LEE, Dae Ki, PARK, Cheol-Hee, KIM, Dong-Sik
Format Patent
LanguageEnglish
French
German
Published 18.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
Bibliography:Application Number: EP20160875953