MICROELECTRONIC COMPONENT ASSEMBLY, SYSTEM HAVING A MICROELECTRONIC COMPONENT ASSEMBLY, AND CORRESPONDING PRODUCTION METHOD FOR A MICROELECTRONIC COMPONENT ASSEMBLY

• Main Authors: HENRICI, Fabian, HERRMANN, Ingo, UTERMOEHLEN, Fabian
• Format: Patent
• Language: English; French; German
• Published: 22.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; COLORIMETRY; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT; MEASURING; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; RADIATION PYROMETRY; SEMICONDUCTOR DEVICES; TESTING

The invention relates to a microelectronic component assembly (100) having a sensor chip (1) for recording thermographic images. The sensor chip (1) has a front side (VS), a back side (RS), and a lateral surface (SF), which connects the front side (VS) to the back side (RS). The microelectronic component assembly (100) also comprises at least one evaluating circuit (A1), wherein the at least one evaluating circuit (A1) is in contact with the sensor chip (1) at least in some regions on the back side (RS) and/or the lateral surface (SF) of the sensor chip (1), and a lens, wherein the lens (L1) is arranged on the front side (VS) of the sensor chip (1) and covers the sensor chip (1), wherein the lateral surface (SF) of the sensor chip (1) and/or a lateral surface (SA) of the evaluating circuit (A1) and a lateral surface (SL) of the lens (L1) have traces of mechanical removal at least in some regions.