HEAT TRANSFER SHEET
[Problem to be solved] An object of the present invention is to provide a thermal transfer sheet in which a transfer layer and a substrate included therein exhibit a high level of adhesion therebetween even when used in a compact printer that causes the thermal transfer sheet to be heated by the hea...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
10.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | [Problem to be solved] An object of the present invention is to provide a thermal transfer sheet in which a transfer layer and a substrate included therein exhibit a high level of adhesion therebetween even when used in a compact printer that causes the thermal transfer sheet to be heated by the heat of a thermal head, and in which the transfer layer exhibits a high level of releasability when being transferred. [Solution] The thermal transfer sheet according to the present invention is characterized by including at least a substrate and a transfer layer: the transfer layer including at least a protective layer provided so as to be peelable from the substrate; the transfer layer having a peel force in a non-heated state of 1 N/m or more; and the transfer layer having a peel force in a heated state of 10 N/m or less. |
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Bibliography: | Application Number: EP20170775425 |