METHOD FOR CUTTING A THIN GLASS LAYER

Method for cutting a glass layer having a first surface a second surface. The method includes moving a first laser beam, which is generated by a pulsed laser, along a cutting line, where material modifications are produced in the interior of the glass layer between the first surface and the second s...

Full description

Saved in:
Bibliographic Details
Main Authors YEH, Li-Ya, BÖKER, Jürgen
Format Patent
LanguageEnglish
French
German
Published 22.09.2021
Subjects
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:Method for cutting a glass layer having a first surface a second surface. The method includes moving a first laser beam, which is generated by a pulsed laser, along a cutting line, where material modifications are produced in the interior of the glass layer between the first surface and the second surface; moving a second laser beam along the cutting line where the glass layer is heated by the laser radiation; and cooling the glass layer along the cutting line, where the glass layer breaks along the cutting line.
Bibliography:Application Number: EP20160750819